Malaysia Launches RM185 Million Semiconductor R&D Initiative
Malaysia initiates a RM185 million program to enhance advanced semiconductor packaging capabilities, targeting a 7% global market share.
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The Malaysian Science, Technology and Innovation Ministry (Mosti) has launched a RM185 million initiative focused on advanced packaging technology. This program aims to help the country secure a seven percent share of the global advanced packaging market.
Funding includes RM92 million from the Malaysia Science Endowment (MSE) and RM93 million from industry partners, with collaboration from five semiconductor companies: SkyeChip Bhd, Inari Technology Sdn Bhd, FusionAP Sdn Bhd, Pentamaster Instrumentation Sdn Bhd, and NSW Automation Sdn Bhd. A high bandwidth memory 4 (HBM4) test chip will be developed as a proof of concept, aligning with national priorities set by the National Science Council in May 2026. The initiative may enhance Malaysia's competitiveness in the global semiconductor industry.
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