Molex Launches Impress Co-Packaged Copper Solutions for 224Gbps Connectivity in AI Data Centers
Molex has introduced Impress Co-Packaged Copper Solutions, designed for 224Gbps PAM-4 connectivity in AI and hyperscale data centers. This innovative solution utilizes a compression-based, on-substrate connector to optimize signal integrity and power distribution. With over one million units of NearStack OTS already delivered, Impress aims to enhance scalability and reduce latency in server architectures. Molex will showcase these technologies at DesignCon 2026 in Santa Clara.
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Molex has launched Impress Co-Packaged Copper Solutions, which support 224Gbps PAM-4 connectivity for AI and hyperscale data centers. This solution offers a compression-based, on-substrate connector that enhances signal integrity and power distribution.
Impress builds on the success of the NearStack On-the-Substrate Connectors, with over one million units delivered. The new system reduces latency and improves space efficiency by placing the connection point directly on the ASIC substrate.
Molex aims to future-proof data center architectures by simplifying maintenance and upgrades. Impress is part of a broader 224G product portfolio and is available for applications up to 224Gbps, with development ongoing for higher rate applications. Molex will present its innovations at DesignCon 2026 in Santa Clara.
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