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Molex has launched Impress Co-Packaged Copper Solutions, which support 224Gbps PAM-4 connectivity for AI and hyperscale data centers. This solution offers a compression-based, on-substrate connector that enhances signal integrity and power distribution.

Impress builds on the success of the NearStack On-the-Substrate Connectors, with over one million units delivered. The new system reduces latency and improves space efficiency by placing the connection point directly on the ASIC substrate.

Molex aims to future-proof data center architectures by simplifying maintenance and upgrades. Impress is part of a broader 224G product portfolio and is available for applications up to 224Gbps, with development ongoing for higher rate applications. Molex will present its innovations at DesignCon 2026 in Santa Clara.