Nikon Develops 1.5-Micron Lithography System for Semiconductor Packaging
Nikon is set to launch a 1.5-micron digital lithography system for advanced semiconductor packaging by fiscal 2027. This system aims for over 65 panels per hour throughput, enhancing productivity by more than 30% compared to the existing DSP-100 model.
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Nikon is developing a new digital lithography system for advanced semiconductor packaging, targeting a launch in fiscal 2027. The system features a 1.5-micron resolution and aims for a throughput exceeding 65 panels per hour for 510 mm by 515 mm substrates, improving productivity by over 30% from the DSP-100, which processes 50 panels per hour.
Advanced packaging is increasingly critical due to the rising demand for next-generation semiconductors, particularly in AI applications. The new system will also allow flexibility to switch to a 1.0-micron mode by altering the optical system, aligning with customer needs. This shift is significant for manufacturing efficiency, particularly for AI server applications requiring dense chip interconnections.
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