Theia

Article

TDK Corporation Introduces FS1525 Stackable µPOL Modules for AI and Data Center Applications

DATA AND AI INFRASTRUCTURE

TDK Corporation has expanded its µPOL family with the FS1525, a 3.82 mm high DC-DC power module delivering up to 25 A, suitable for AI servers and data center systems. By stacking modules, combined current output can reach 200 A.

The FS1525 integrates critical components in a 7.65 x 6.80 mm footprint, featuring a thermal impedance of 1.4 K/W for improved performance. It supports input voltages from 4.5 V to 16 V and output ranges from 0.6 V to 1.8 V, optimized for modern AI processors.

Key features include fast transient response, low ripple, and digital programmability for voltage and current management. The module supports various computing form factors and enhances overall system efficiency.

TDK Corporation Introduces FS1525 Stackable µPOL Modules for AI and Data Center Applications
Feb 7, 2026, 6:00 AM

No comments yet. Be the first to share your thoughts!