TDK Corporation Introduces FS1525 Stackable µPOL Modules for AI and Data Center Applications
TDK Corporation has launched the FS1525, a 3.82 mm high non-isolated DC-DC power module that supports up to 25 A. Designed for AI servers and data centers, it can be stacked to deliver up to 200 A. The FS1525 features advanced 3D chip-embedded technology, thermal efficiency, and supports input voltages from 4.5 V to 16 V. It integrates various components into a compact footprint and is optimized for low-voltage AI processors. The module includes digital programmability for real-time monitoring and is compatible with various computing form factors.
Theia Market Signal Identification - AI Assisted
TDK Corporation has expanded its µPOL family with the FS1525, a 3.82 mm high DC-DC power module delivering up to 25 A, suitable for AI servers and data center systems. By stacking modules, combined current output can reach 200 A.
The FS1525 integrates critical components in a 7.65 x 6.80 mm footprint, featuring a thermal impedance of 1.4 K/W for improved performance. It supports input voltages from 4.5 V to 16 V and output ranges from 0.6 V to 1.8 V, optimized for modern AI processors.
Key features include fast transient response, low ripple, and digital programmability for voltage and current management. The module supports various computing form factors and enhances overall system efficiency.
Comments