TSMC Seeks Approval for Advanced Wafer Fab in Longtan, Taiwan
TSMC plans to submit a proposal for a new wafer fab at Longtan in Hsinchu Science Park, with potential investments of up to NT$600 billion. The project aims to utilize advanced 'angstrom-class' processes to meet AI computing demands, indicating a strategic focus on high-end technology development in Taiwan.
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Taiwan Semiconductor Manufacturing Co. (TSMC) is moving forward with plans to establish an advanced wafer fabrication facility at the Longtan Campus of Hsinchu Science Park, pending government approval.
The proposal for the third phase of the Longtan Science Park will be presented to the National Science and Technology Council later this month. Previously, TSMC aimed to build a fab with a process exceeding its 2-nanometer technology, but the initiative was halted due to local opposition in 2023.
Now, with local sentiment reportedly shifting favorably, TSMC is expected to invest NT$500 billion to NT$600 billion (approximately US$15.82 billion to US$18.98 billion) into this 'angstrom-class' project, targeting advancements in AI computing technology. The company continues to emphasize Taiwan as its key production base while exploring suitable expansion locations.
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