Article

Umicore has expanded its hard gold portfolio with AURUNA® 8000, a high-speed electrolyte for selective and continuous gold plating. It achieves deposition rates of up to 8 µm/min and features hardness around 130 HV with low contact transition resistance.

AURUNA® 8000 is free from cobalt and nickel, reducing health risks and regulatory costs. The product supports existing processes and can be easily integrated into current systems. It also allows up to 15% reduction in gold consumption when used with AURUNA® Inhibitor 2. This product caters to various electroplating processes, ensuring sustainability and high quality.