Umicore Launches AURUNA® 8000, a Sustainable High-Speed Electrolyte for Hard Gold Plating
Umicore has introduced AURUNA® 8000, a high-performance, high-speed electrolyte for selective and continuous gold plating. This new product achieves deposition rates of up to 8 µm/min and is designed for high-speed systems, offering a sustainable alternative to cobalt- and nickel-containing processes. AURUNA® 8000 meets ASTM B 488 01: Type I, Code C standards, ensuring low contact transition resistance and high reliability. It integrates easily into existing processes, allowing companies to enhance sustainability without infrastructure changes.
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Umicore has expanded its hard gold portfolio with AURUNA® 8000, a high-speed electrolyte for selective and continuous gold plating. It achieves deposition rates of up to 8 µm/min and features hardness around 130 HV with low contact transition resistance.
AURUNA® 8000 is free from cobalt and nickel, reducing health risks and regulatory costs. The product supports existing processes and can be easily integrated into current systems. It also allows up to 15% reduction in gold consumption when used with AURUNA® Inhibitor 2. This product caters to various electroplating processes, ensuring sustainability and high quality.
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