U.S. Army Seeks Industry Collaboration for Advanced Electronics and Sensor Technologies
The U.S. Army's DEVCOM at Picatinny Arsenal is soliciting industry input on advanced electronics and sensor technologies for weapons systems. The focus includes microsystem chip fabrication using DRIE, anti-tamper systems for remote armament, and distributed sensors for threat detection. Key requirements emphasize affordability, operational capability in harsh environments, and compliance with military standards. Additional interests include miniature power amplifiers, RF integrated circuits, and AI-driven situational awareness technologies.
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The U.S. Army's DEVCOM at Picatinny Arsenal has issued a broad agency announcement for industry collaboration on advanced electronics and sensor technologies for weapons systems. The project seeks innovations in microsystem chip fabrication using DRIE, anti-tamper systems for remote armament, and distributed radar and infrared sensors for threat detection and fire control.
Requirements include affordability, functionality in harsh environments, and adherence to military standards. The Army is also interested in high-efficiency power amplifiers, RF integrated circuits, and AI technologies for enhanced situational awareness and autonomous operations.
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