Article

Aspocomp has implemented a new copper plating line at its Finnish PCB factory, integrating electroless and electrolytic copper plating in a single flow. This solution enhances process control and manufacturing capacity.

The line applies a low-build electroless copper layer, followed by 3-5 micrometres of electrolytic copper, to improve plated through-hole quality and support higher aspect ratio through-holes. The investment boosts copper plating capacity by 1.5 times, reducing lead times and increasing throughput. The project is co-funded by the EU's Just Transition Fund.