Aspocomp Enhances PCB Production with New Copper Plating Line in Finland
Aspocomp has installed a new copper plating line at its Finnish PCB factory, combining electroless and electrolytic copper processes. This investment aims to improve process control and increase copper plating capacity by 1.5 times, enhancing lead times and throughput. The project is co-funded by the EU's Just Transition Fund.
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Aspocomp has implemented a new copper plating line at its Finnish PCB factory, integrating electroless and electrolytic copper plating in a single flow. This solution enhances process control and manufacturing capacity.
The line applies a low-build electroless copper layer, followed by 3-5 micrometres of electrolytic copper, to improve plated through-hole quality and support higher aspect ratio through-holes. The investment boosts copper plating capacity by 1.5 times, reducing lead times and increasing throughput. The project is co-funded by the EU's Just Transition Fund.
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