China Develops Diamond-Copper Cooling Technology for AI Data Centers
Chinese researchers have developed a diamond-copper composite cooling technology that increases cooling efficiency by 80%, enhancing chip performance by 10%. This innovation aims to reduce China's technological dependency and redefine thermal management standards in the global AI competition.
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Researchers from the Ningbo Institute of Industrial Technology have created a diamond-copper composite material that overcomes thermal wall challenges in AI data centers. This technology improves cooling efficiency by 80% and allows for a 10% increase in chip performance.
The composite material, tested in Henan province, surpasses industry standards for thermal conductivity, achieving over 1,000 W/m·K. A strategic partnership with Jiangxi Copper Company aims to scale production and address manufacturing challenges. This innovation aligns with sustainability goals by offering drier and more efficient heat management compared to traditional cooling methods, reducing water and energy consumption.
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