Fujibo to Invest ¥5.3 Billion in Semiconductor Materials Expansion in Oita
Fujibo Holdings plans a ¥5.3 billion investment to expand semiconductor polishing materials production at its Oita plant. Construction of a new building will start in April 2027 and finish by September 2028, with operations commencing in April 2029. The expansion aims to increase output of polishing pads, where Fujibo holds an 80% global market share, driven by rising demand in AI-related semiconductor production. By 2030, sales at the Oita facility are projected to reach 3.3 times the fiscal 2025 level.
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Fujibo Holdings is set to invest approximately ¥5.3 billion to expand its semiconductor polishing materials production at the Oita plant in Oita City. A new processing and office building will be constructed on the eight-hectare site, with construction starting in April 2027 and completion by September 2028.
Operations are anticipated to begin in April 2029. The expansion will boost the output of polishing pads, crucial for chemical mechanical polishing of semiconductor wafers, where Fujibo commands an estimated 80% global market share.
The growing demand for these materials is driven by increased investment in AI-related semiconductor manufacturing, with sales expected to reach 3.3 times fiscal 2025 levels by 2030. The facility will also function as a backup production site.
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