Intel to Launch Advanced Packaging Complex in Malaysia by Year-End
Intel's advanced packaging complex in Malaysia will commence operations later this year, expanding the company's semiconductor investment. Prime Minister Anwar Ibrahim confirmed the development after a briefing with Intel CEO Tan Lip-Bu, focusing on assembly, testing, and local talent training. This initiative aligns with Malaysia's MADANI Economy goals to generate high-value jobs and strengthen the semiconductor sector.
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Intel Corporation will begin operations at its advanced packaging complex in Malaysia later this year, as confirmed by Prime Minister Anwar Ibrahim. The complex will focus on assembly and testing, key components of Intel's investment expansion.
Naga Chandrasekaran, Intel Foundry's Executive VP, outlined plans for the first operational phase. The discussions also emphasized the importance of training local talent to create high-value jobs, aligning with the government's MADANI Economy aspirations. This move is part of Malaysia's strategy to enhance its position in the global semiconductor value chain.
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