Sivers Semiconductors Partners with O-Net Technologies and Enablence for AI Data Center Optical Module

Sivers Semiconductors, O-Net Technologies, and Enablence Technologies have formed a strategic partnership to develop an advanced external light source module (ELS) for AI data centers and high-performance computing. The ELS module will utilize Sivers' laser arrays to support the rollout of Co-Packaged Optics (CPO), enabling scalable optical systems with reduced energy consumption. CPO technology aims to address heat generation and energy demands in data centers by integrating optical components closer to chips, potentially reducing energy use by 80% compared to copper.

Published Mar 24, 2026

Sivers Semiconductors, O-Net Technologies, and Enablence Technologies are collaborating to create an external light source module (ELS) for AI data centers and high-performance computing (HPC). The ELS will employ Sivers' laser arrays to facilitate Co-Packaged Optics (CPO) deployment, with O-Net integrating Sivers' technology with Enablence's NxN star Coupler.

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This partnership aims to deliver a scalable ELS module for next-generation optical systems, addressing heat and energy consumption challenges in data centers. CPO technology allows for more ports per switch, crucial for managing large data volumes in AI and ML clusters.

Sivers anticipates that CPO will incorporate most optical components in GPU and switch packages, ensuring optical high-speed connections with 80% lower energy consumption than copper. IDTechEx forecasts the CPO market will exceed $20 billion by 2036, growing at a CAGR of 37% from 2026 to 2036, with ELS solutions projected to comprise about 10% of this market.