SKC to Merge with SK enpulse to Enhance Semiconductor Operations
SKC Co. will merge with SK enpulse to strengthen its semiconductor back-end packaging capabilities. This merger is projected to finalize within 2026, securing approximately 380 billion won ($267.4 million) for investments in advanced semiconductor technologies.
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SKC Co. is set to merge with its subsidiary SK enpulse as part of a strategic reorganization aimed at enhancing its semiconductor back-end packaging segment. The merger, approved by SKC's board, is expected to conclude within 2026 and will enable the company to access about 380 billion won in funds, including cash and proceeds from previous divestitures.
These funds will support investments in advanced packaging technologies and the commercialization of glass substrates. SKC has been divesting non-core semiconductor materials businesses since 2023 to focus on high-value segments, spinning off certain divisions and creating I-SEMI Co. for back-end equipment. This shift aligns SKC’s semiconductor operations with ISC's testing equipment and Absolics Inc.'s glass substrate business, which is moving towards production in the U.S.
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