xLight Secures $150 Million CHIPS Funding for Semiconductor Innovations
xLight has finalized a $150 million agreement with the U.S. government under the CHIPS Act to enhance semiconductor manufacturing. This funding will facilitate the development of xLight's first free-electron laser to improve EUV light delivery in semiconductor production.
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xLight has signed a final award agreement for $150 million in federal incentives under the CHIPS and Science Act, aimed at supporting the construction of its first free-electron laser (FEL). This technology is intended to transform extreme-ultraviolet (EUV) light delivery to semiconductor fabrication facilities, addressing anticipated demand that may exceed global manufacturing capacity.
The FEL systems are designed to provide higher power levels to multiple lithography scanners, potentially boosting productivity and lowering production costs. xLight's first commercial-scale system is being developed in Albany, New York, with backing from the Department of Commerce and industry partners. The impact of this innovation could significantly enhance semiconductor architecture and productivity.
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