ZutaCore Secures $100 Million Series C Funding for Waterless Cooling Technology
ZutaCore has raised $100 million in Series C funding to enhance its waterless, direct-to-chip cooling solutions. This capital, backed by major firms like Mitsubishi Electric and Samsung Ventures, will support the global rollout of its two-phase cooling technology, addressing the heat challenges in AI and HPC infrastructure.
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ZutaCore has completed a Series C funding round of $100 million to accelerate the deployment of its two-phase cooling technology. This funding received strategic support from firms such as Mitsubishi Electric, Carrier Ventures, and Samsung Ventures.
The company aims to address the increasing power density in AI and HPC processors, which are now exceeding 1,000 watts. ZutaCore's waterless cooling platform is designed for future processors exceeding 4,000 watts, enabling higher computing densities without water leakage risks.
The company operates over 75 production sites globally and has established a 2 megawatt test platform in Israel to simulate data center conditions, reducing implementation risks for clients. Four new executives have been appointed to manage the growing demand and order pipeline. Goldman Sachs served as the exclusive placement agent for this funding round.
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